Rashi Peripherals has announced “Mega Summer Bonanza” on the purchase of ECS products to give more value to its loyal partners. The focus of this scheme is to reward and motivate partners to accelerate business during the vacation time for entire range of ECS motherboards available in India through Rashi Peripherals. The scheme will run throughout the summer starting from 01st April to 30th June, 2011.
Under the Mega Summer Bonanza, partners will be entitled to win Apple iPads, air conditioners, double-door refrigerators, digital cameras, water purifiers, Micromax mobile phones, etc., as per fixed slabs.
Announcing the offer, Karan Khemka, Product Manager, ECS, Rashi Peripherals, said, “We have had one of the best period for ECS motherboards in recent times. So, we thought of giving an extra incentive to reward the partners who have been a constant support to us. We want our partners to capitalize on their hard work and win some gifts.”
Rashi has launched this scheme after receiving an outstanding response to the “ECS Channel Promotion programme” launched in the last quarter this year.
The Mega Summer Bonanza scheme will be valid on purchases made through all branches of Rashi Peripherals all across the country.
VIA Technologies has announced t VIA AMOS-5001, a specially designed chassis kit for Em-ITX form-factor boards enabling the rapid and easy assembly of a wide variety of robust fan-less embedded system designs.
Measuring just 35.2mm high and 231mm wide, the ultra-compact VIA AMOS-5001 is slim enough to fit in even the most space-constrained environment. Systems built using the VIA AMOS-5001 are also shock resistant and can withstand even the most extreme temperatures.
The VIA AMOS-5001 chassis kit features a unique modular design comprised of only four mechanical parts that ensures the easy integration of VIA EITX-3001 series mainboards. An optional 2.5″ HDD storage subsystem chassis is also available.
“With the VIA AMOS-5001, we are further expanding the options we offer to embedded developers to create a wealth of unique fan-less designs using less time and fewer resources,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “This is in line with our broader strategy of providing a comprehensive and flexible product ecosystem that gives our customers a clear advantage in the market.”
The VIA AMOS-5001 is available now and is targeted at a wide variety of embedded segments, including medical, POI/POS, digital signage, kiosk, industrial and building automation, and gaming and surveillance applications.
Micro Star International (MSI) has appointed Inspan Infotech as its distributor for South India. Aimed at strengthening their distribution network in India, this is MSI’s second strategic tie-up after Redington. With over 5,000 channel partners across the country, Inspan Infotech has an impressive track record. This strategic tie-up would increase MSI’s penetration in the B-, C- & D- class cities.
Commenting on this tie-up, Eric Kuo, MSI India head, General Manager, India, said, “Recently, we have been focussing more on our regional expansion and strengthening our distribution network to ensure that we are better enabled to reach the market and meet our customers’ needs.”
He also added, “Through this partnership, we are going to address the faster response time and efficient real-time data processing through our notebooks. Inspan’s strong presence in India will help us reach to the end-consumers more effectively.”
“Inspan being one of the most effective and successful distributors in India, partnering with MSI adds the amazing range of notebooks in its distribution list,” remarked S. Sudhir, Managing Director, Inspan Infotech.
The HP Performance-optimized Data Center (POD) enables customers in India to rapidly expand compute capacity with a scalable, flexible and secure infrastructure to support new business growth. The HP POD offers Web 2.0, cloud computing, high-performance computing (HPC) and enterprise customers with limited space, budget or critical mobility needs to remain competitive by lowering costs, increasing facility efficiency and accelerating time to market.
“Keeping pace with the demands of IT growth in the data center, as well as rising energy costs is a constant challenge. The extended time and significant costs required to update or expand a data center adds to the complexity,” said Rajesh Dhar, director, Industry Standard Servers, HP India. “With the HP POD, customers now have the flexibility to balance their capital expenditures and operating expenses while quickly and seamlessly meeting their needs for additional capacity.”
Designed specifically to support a wide range of industry-standard technology, the HP POD provides customers with more density than competitive offerings by supporting more than 3,500 compute nodes or 12,000 large form-factor (LFF) hard drives, in a 20- or 40-foot shipping container. It offers flexible configurations optimized for power or density, which enables customers to quickly upgrade or extend the capacity of their physical infrastructures to meet their specific business needs.
D-Link has introduced KVM-222 – a 2 port KVM (Keyboard, Video & Mouse) switch that allows a user to control two PCs from a single keyboard, mouse, and VGA monitor console. Hence if a user has 2 PC’s he need not worry about buying an additional set of Keyboard & mice, as he can now easily perform all his task/ job with this wonder device. Additionally D-Link KVM-222 comes with a audio support feature that allows the two connected PCs to share a set of speakers via. a standard 3.5 mm stereo jack. Therefore D-Link KVM-222 not only allows user to keep his precious desk space free, but also helps save additional cost.
D-Link KVM-222 utilizes advanced microprocessor emulation that allows user to boot two computer systems simultaneously without faults or keyboard errors. Auto scan, audible feedback, and hot key features make the KVM-222 extremely simple to use and manage. A convenient wired remote control button simplifies the switching process even further, allowing users to place the switch in a convenient location.
Madhwesh Kulkarni joins Aricent as the Vice-President of Engineering and Offer Management in the Carrier Services and Solutions (CSS) SBU. At Aricent, he will be responsible for building a global team of strategists, consultants and engineers to deliver innovative solutions and services to carriers across the globe.
Madhwesh Kulkarni joins Aricent from Wipro where he most recently served as General Manager – APAC, Communications and Media Business and Head of Communications consulting practices. With more than 19 years of experience in the IT/telecom industry, he has worked closely with more than 40 telecom service providers globally. As one of the founder members of Telecom Service Provider Business Unit of Wipro, he provided strategic inputs to leading Telecom Operators across USA, Europe, Middle East and Japan. He was also associated with all major OSS-BSS ISVs and telecom equipment vendors in various roles and capacities. During his Wipro days, he was also on the board of Tele Management Forum as an advisory director.
A veteran in the communications industry, Madhwesh holds a Bachelor’s degree in Electronics and Communication Engineering from REC Surathkal, Karnataka, India.
Snapdeal.com has achieved yet another milestone. The e-commerce portal has sold 30,000 deals in a single day on April 25, 2011, probably one of the highest numbers of transactions on any e-commerce site in a single day in India. Over a short span of just one year, Snapdeal has grown exponentially and has become a household name with over 4 million subscribers. The e-commerce portal, which has also become synonymous with great deals, enjoys unrivalled reach and penetration.
Snapdeal.com sold prepaid recharge of Rs.100 for Rs.50 at an amazing discount of 50% for leading telecom service providers like Aircel, Vodafone, Tata Indicom, Idea, Virgin Mobile, etc. At one point of time during the day, Snapdeal.com was selling 100 deals in one single minute. “It feels great to achieve a milestone of this magnitude and I will ensure that we keep coming up with more innovative deals for our customers,” said Kunal Bahl, Founder & CEO, Snapdeal.com.